Microelectronics

Backside Emission through silicon, 1500X magnification	PBGA solder ball cross-section, Brightfield 500X magnification	Sectioned ceramic substrate with socket pin, Oblique 16X magnification	CMP delayering of an IC, Brightfield 200X magnification
FIB/TEM cross-section of an IC	IC cross-section, Brightfield 1500X magnification	Parallel delayering of an IC, Brightfield 1000X magnification	Parallel delayering of an IC, Brightfield 500X magnification
PCB parallel delayering, Oblique 10X magnification	PCB through hole cross-section, Brightfield 200X magnification	SIMS backside thinning of an IC, Brightfield 1000X magnification	SEM cross-section of an IC
See an image you like? We would be happy to send you a larger version by email. Click here to request the image of your choice, or send an email to info@alliedhightech.com. Please be sure to include the image title in your message!