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Colloidal Silica / Alumina Suspensions
Used for final polishing, colloidal suspensions are mixtures
of abrasive particles dispersed throughout a chemically
aggressive liquid carrier. This combination provides a
chemical-mechanical polishing action, resulting in
deformation-free surfaces.
| 0.05 µm Non-Crystallizing Colloidal Silica |
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A non-crystallizing silica suspension with a pH of 9.8.
Excellent final polish for a wide variety of materials, especially non-ferrous metals, PCBs and ICs.
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| 0.02 µm Non-Crystallizing Colloidal Silica |
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A non-crystallizing silica suspension with a pH of 9.8.
Used to provide ultrafine surface finishes for demanding SEM/TEM analysis.
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| 0.05 µm & 0.03 µm Colloidal Alumina |
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An acidic alumina suspension with a pH of 3.5 used to
final polish ferrous metals and ceramics. This non-clogging formula flows easily through fluid dispensing
systems and can be diluted with DI water up to 3:1.
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| 0.04 µm Non-Stick/Rinsable Colloidal Silica |
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An excellent final polishing suspension for most materials, this proprietary formula features a pH of 10.5 and rinses easily from samples and equipment, even after it dries. It is slow-drying, making it an ideal choice for prolonged polishing requirements such as those for EBSD. The pH may be modified with chemical solutions to improve microstructural contrast.
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| 0.05 µm Colloidal Silica/Alumina Solution |
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A unique mixture of colloidal silica and alumina with a pH of 8.5. The addition of gamma alumina allows improved mechanical polishing when compared to colloidal silica. Used to final polish both ferrous and non-ferrous metals, metal-matrix composites and various non-metallic materials.
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