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The MultiPrep™ System enables precise semi-automatic sample preparation of a wide range of materials for microscopic (optical, SEM, FIB, TEM, AFM, etc.) evaluation. Capabilities include parallel polishing, angle polishing, site-specific polishing or any combination thereof. It provides reproducible sample results by eliminating inconsistencies between users, regardless of their skill.

Dual micrometers (pitch and roll) allow precise sample tilt adjustments relative to the abrasive plane. A rigid Z-indexing spindle maintains the pre-defined geometric orientation throughout the grinding/polishing process.

Digital indicators enable quantifiable material removal, which can be monitored real-time, or pre-set for unattended operation. Variable speed rotation and oscillation maximize use of the entire abrasive/polishing disc and minimize artifacts. Adjustable load control expands its capability to handle a range of small (delicate) to large samples.

Common applications include parallel circuit delayering, cross-sectioning, serial/3-D preparation, wedge polishing and more.

Why Choose the 12" MultiPrep?

A 12" platen and scaled positioning device with higher torque rotation/oscillation motors allow preparation of large or multiple samples exceeding an area
of 1600 mm2.

MultiPrep Features:

• Front digital indicator displays real-time material removal (sample advancement), 1 micron resolution
• Precision spindle design indexes the sample perpendicular to the platen, and can rotate simultaneously
• Dual axis, micrometer-controlled angular positioning of the sample (pitch and roll), +10/-2.5° range, 0.01° accuracy
• Rear digital indicator displays vertical positioning (static) with zeroing function, 1 micron resolution
• Automatic sample oscillation, adjustable sweep with 6 speeds
• Gear-driven spindle for applications demanding higher rotational torque, i.e., larger or encapsulated samples
• Cam-locking system eliminates the need for tools and allows for precise repositioning of fixtures
• Full or limited automatic sample rotation with 8 speeds
• Variable sample load, 0-600 grams, in 100-gram increments
• Variable platen speed: 5-350 RPM (5 RPM increments)
• Touch-pad switches controll all functions
• ¼ HP (190 W) motor with durable reduction gearbox provides high-torque
• Digital timer and tachometer
• Clockwise/counterclockwise platen rotation
• Bowl flush to prevent debris buildup
• Electronic coolant control with adjustable valve
• CE Compliant
• Two (2) year warranty - parts and labor
• Designed & manufactured in the USA

The MultiPrep^™ System provides Unequalled Results in a variety of sample preparation applications. To learn more, view the Acrobat PDF file below.

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Holds either the #15-1010 Cross-Sectioning Paddle or the #15-1013 TEM Wedge/FIB Thinning Paddle. It extends the paddle/sample from under the hub assembly for easy viewing and handling.

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Holds flat, unencapsulated samples perpendicular to the platen. They have a removable pin and female port allowing easy adaptation to an SEM chamber and are made of aluminum. Samples are typically secured using hot mounting wax.

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Holds flat, unencapsulated samples perpendicular to the platen and has a reference edge to allow for better alignment. They have a removable pin and female port allowing easy adaptation to an SEM chamber and are made of aluminum. Samples are typically secured using hot mounting wax.

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Used for second side TEM wedge polishing and single specimen FIB thinning of IC’s and other small samples. The Pyrex stub (5.3mm W x 3.5mm D x 6 mm L) is permanently bonded to the aluminum body and allows light to easily pass through for optical examination.

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Used for wedge/plan-view TEM polishing, multiple sample FIB thinning and precision parallel semiconductor thinning for SIMS analysis. Includes removable #69-40015 Pyrex inserts (½" diameter, Pk/4) which allow light through for optical examination.

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This fixture features a ½” diameter Pyrex glass insert secured to an aluminum body that allows light to pass through the Pyrex for transmitted light observation of sample thickness when thinning silicon based devices from the backside for SIMS analysis. Samples are secured to a square glass microscope slide using EpoxyBond 110 and then secured to the Pyrex of this fixture, once it is planarized, using wax.

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Used for parallel delayering and backside polishing of IC’s and other electronic devices. They are made of stainless steel and precision lapped, parallel to within 2 microns. Samples are secured using wax or double-sided tape. The numbered grid aids with sample orientation.

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Used for parallel delayering and backside polishing of IC’s and other electronic devices. They are made of stainless steel and precision lapped, parallel to within 2 microns. Samples are secured using wax or double-sided tape. The numbered grid aids with sample orientation.

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Teardrop Fixture, 40 mm Mount Capacity

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Used for applications where the sample size requires more load than the spindle can provide (approximately 600 grams). Includes (2) barrel weights and (3) slotted weights totaling 650 grams. Note: Dial Indicator must be removed when using barrel weights.

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Used to hold larger, flat encapsulated or unencapsulated samples perpendicular to the platen. Samples are typically secured in the fixture, sectioned close to the area of interest on the TechCut™ Precision Sectioning Machine, then attached to the MultiPrep™ for polishing, assuring that the desired polishing plane is maintained throughout the preparation procedure.

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Used in the same manner as #15-1045, except it orients the sample at a 45° angle. Typically used for precision cross-sectioning of electronic packages. Teflon screws provide gentle but firm pressure on delicate samples.

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Used to hold larger, flat encapsulated or unencapsulated samples perpendicular to the platen. Samples are typically secured in the fixture, sectioned close to the area of interest on the TechCut™ Precision Sectioning Machine, then attached to the MultiPrep™ for polishing, assuring that the desired polishing plane is maintained throughout the preparation procedure.

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Used in the same manner as #15-1047, except it orients the sample at a 45° angle. Typically used for precision cross-sectioning of electronic packages. Teflon screws provide gentle but firm pressure on delicate samples.

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Clamp style sample fixture which holds delicate samples between 2 flat, lined surfaces.

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Used in the same manner as #15-1050, except it orients the sample at a 45° angle.

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The Dial Indicator Measurement System is used to verify sample thickness or removal of material. Typical applications include thinning of silicon for emission microscopy or SIMs analysis, plan-view TEM preparation, and TEM/FIB Thinning. It features a precision granite stand and height adjustable indicator position. The remote cable (sold separately) allows lifting of the spindle without altering dial position. The dial indicator displays both metric and imperial indicator units in 1 micron/0.001 resolution.